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模拟CMOS集成电路设计 影印版2025|PDF|Epub|mobi|kindle电子书版本百度云盘下载
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- 罗扎(Rozavi,B.)著 著
- 出版社: 北京:清华大学出版社
- ISBN:7302108862
- 出版时间:2005
- 标注页数:684页
- 文件大小:35MB
- 文件页数:702页
- 主题词:模拟集成电路-电路设计-高等学校-教材-英文
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图书目录
1 Introduction to Analog Design1
1.1 Why Analog?1
1.2 Why Integrated?6
1.3 Why CMOS?6
1.4 Why This Book?7
1.5 General Concepts7
1.5.1 Levels of Abstraction7
1.5.2 Robust Analog Design7
2 Basic MOS Device Physics9
2.1 General Considerations10
2.1.1 MOSFET as a Switch10
2.1.2 MOSFET Structure10
2.1.3 MOS Symbols12
2.2 MOS I/V Characteristics13
2.2.1 Threshold Voltage13
2.2.2 Derivation of I/V Characteristics15
2.3 Second-Order Effects23
2.4 MOS Device Models28
2.4.1 MOS Device Layout28
2.4.2 MOS Device Capacitances29
2.4.3 MOS Small-Signal Model33
2.4.4 MOS SPICE models36
2.4.5 NMOS versus PMOS Devices37
2.4.6 Long-Channel versus Short-Channel Devices38
3 Single-Stage Amplifiers47
3.1 Basic Concepts47
3.2 Common-Source Stage48
3.2.1 Common-Source Stage with Resistive Load48
3.2.2 CS Stage with Diode-Connected Load53
3.2.3 CS Stage with Current-Source Load58
3.2.4 CS Stage with Triode Load59
3.2.5 CS Stage with Source Degeneration60
3.3 Source Follower67
3.4 Common-Gate Stage76
3.5 Cascode Stage83
3.5.1 Folded Cascode90
3.6 Choice of Device Models92
4 Differential Amplifiers100
4.1 Single-Ended and Differential Operation100
4.2 Basic Differential Pair103
4.2.1 Qualitative Analysis104
4.2.2 Quantitative Analysis107
4.3 Common-Mode Response118
4.4 Differential Pair with MOS Loads124
4.5 Gilbert Cell126
5 Passive and Active Current Mirrors135
5.1 Basic Current Mirrors135
5.2 Cascode Current Mirrors139
5.3 Active Current Mirrors145
5.3.1 Large-Signal Analysis149
5.3.2 Small-Signal Analysis151
5.3.3 Common-Mode Properties154
6 Frequency Response of Amplifiers166
6.1 General Considerations166
6.1.1 Miller Effect166
6.1.2 Association of Poles with Nodes169
6.2 Common-Source Stage172
6.3 Source Followers178
6.4 Common-Gate Stage183
6.5 Cascode Stage185
6.6 Differential Pair187
Appendix A:Dual of Miller’s Theorem193
7 Noise201
7.1 Statistical Characteristics of Noise201
7.1.1 Noise Spectrum203
7.1.2 Amplitude Distribution206
7.1.3 Correlated and Uncorrelated Sources207
7.2 Types of Noise209
7.2.1 Thermal Noise209
7.2.2 Flicker Noise215
7.3 Representation of Noise in Circuits218
7.4 Noise in Single-Stage Amplifiers224
7.4.1 Common-Source Stage225
7.4.2 Common-Gate Stage228
7.4.3 Source Followers231
7.4.4 Cascode Stage232
7.5 Noise in Differential Pairs233
7.6 Noise Bandwidth239
8 Feedback246
8.1 General Considerations246
8.1.1 Properties of Feedback Circuits247
8.1.2 Types of Amplifiers254
8.2 Feedback Topologies258
8.2.1 Voltage-Voltage Feedback258
8.2.2 Current-Voltage Feedback263
8.2.3 Voltage-Current Feedback266
8.2.4 Current-Current Feedback269
8.3 Effect of Loading270
8.3.1 Two-Port Network Models270
8.3.2 Loading in Voltage-Voltage Feedback272
8.3.3 Loading in Current-Voltage Feedback275
8.3.4 Loading in Voltage-Current Feedback278
8.3.5 Loading in Current-Current Feedback281
8.3.6 Summary of Loading Effects283
8.4 Effect of Feedback on Noise284
9 Operational Amplifiers291
9.1 General Considerations291
9.1.1 Performance Parameters291
9.2 One-Stage Op Amps296
9.3 Two-Stage Op Amps307
9.4 Gain Boosting309
9.5 Comparison313
9.6 Common-Mode Feedback314
9.7 Input Range Limitations325
9.8 Slew Rate326
9.9 Power Supply Rejection334
9.10 Noise in Op Amps336
10 Stability and Frequency Compensation345
10.1 General Considerations345
10.2 Multipole Systems349
10.3 Phase Margin351
10.4 Frequency Compensation355
10.5 Compensation of Two-Stage Op Amps361
10.5.1 Slewing in Two-Stage Op Amps368
10.6 Other Compensation Techniques369
11 Bandgap References377
11.1 General Considerations377
11.2 Supply-Independent Biasing377
11.3 Temperature-Independent References381
11.3.1 Negative-TC Voltage381
11.3.2 Positive-TC Voltage382
11.3.3 Bandgap Reference384
11.4 PTAT Current Generation390
11.5 Constant-Gm Biasing392
11.6 Speed and Noise Issues393
11.7 Case Study397
12 Introduction to Switched-Capacitor Circuits405
12.1 General Considerations405
12.2 Sampling Switches410
12.2.1 MOSFETS as Switches410
12.2.2 Speed Considerations414
12.2.3 Precision Considerations417
12.2.4 Charge Injection Cancellation421
12.3 Switched-Capacitor Amplifiers423
12.3.1 Unity-Gain Sampler/Buffer424
12.3.2 Noninverting Amplifier432
12.3.3 Precision Multiply-by-Two Circuit438
12.4 Switched-Capacitor Integrator439
12.5 Switched-Capacitor Common-Mode Feedback442
13 Nonlinearity and Mismatch448
13.1 Nonlinearity448
13.1.1 General Considerations448
13.1.2 Nonlinearity of Differential Circuits452
13.1.3 Effect of Negative Feedback on Nonlinearity454
13.1.4 Capacitor Nonlinearity457
13.1.5 Linearization Techniques458
13.2 Mismatch463
13.2.1 Offset Cancellation Techniques471
13.2.2 Reduction of Noise by Offset Cancellation476
13.2.3 Alternative Definition of CMRR478
14 Oscillators482
14.1 General Considerations482
14.2 Ring Oscillators484
14.3 LC Oscillators495
14.3.1 Crossed-Coupled Oscillator499
14.3.2 Colpitts Oscillator502
14.3.3 One-Port Oscillators505
14.4 Voltage-Controlled Oscillators510
14.4.1 Tuning in Ring Oscillators512
14.4.2 Tuning in LC Oscillators521
14.5 Mathematical Model of VCOs525
15 Phase-Locked Loops532
15.1 Simple PLL532
15.1.1 Phase Detector532
15.1.2 Basic PLL Topology533
15.1.3 Dynamics of Simple PLL542
15.2 Charge-Pump PLLs549
15.2.1 Problem of Lock Acquisition549
15.2.2 Phase/Frequency Detector and Charge Pump550
15.2.3 Basic Charge-Pump PLL556
15.3 Nonideal Effects in PLLs562
15.3.1 PFD/CP Nonidealities562
15.3.2 Jitter in PLLs567
15.4 Delay-Locked Loops569
15.5 Applications572
15.5.1 Frequency Multiplication and Synthesis572
15.5.2 Skew Reduction574
15.5.3 Jitter Reduction576
Appendix A Short-Channel Effects and Device Models579
A.1 Scaling Theory579
A.2 Short-Channel Effects583
A.2.1 Threshold Voltage Variation583
A.2.2 Mobility Degradation with Vertical Field585
A.2.3 Velocity Saturation587
A.2.4 Hot Carrier Effects589
A.2.5 Output Impedance Variation with Drain-Source Voltage589
A.3 MOS Device Models591
A.3.1 Level 1 Model592
A.3.2 Level 2 Model593
A.3.3 Level 3 Model595
A.3.4 BSM Series596
A.3.5 Other Models597
A.3.6 Charge and Capacitance Modeling598
A.3.7 Temperature Dependence599
A.4 Process Corners599
A.5 Analog Design in a Digital World600
Appendix B CMOS Processing Technology604
B.1 General Considerations604
B.2 Wafer Processing605
B.3 Photolithography606
B.4 Oxidation608
B.5 Ion Implantation608
B.6 Deposition and Etching611
B.7 Device Fabrication611
B.7.1 Active Devices611
B.7.2 Passive Devices616
B.7.3 Interconnects624
B.8 Latch-Up627
Appendix C Layout and Packaging631
C.1 General Layout Considerations631
C.1.1 Design Rules632
C.1.2 Antenna Effect634
C.2 Analog Layout Techniques635
C.2.1 Multifinger Transistors635
C.2.2 Symmetry637
C.2.3 Reference Distribution642
C.2.4 Passive Devices644
C.2.5 Interconnects653
C.3 Substrate Coupling660
Index677
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