国外电子信息精品著作 芯片和系统的电源完整性建模与设计 英文2025|PDF|Epub|mobi|kindle电子书版本百度云盘下载

国外电子信息精品著作 芯片和系统的电源完整性建模与设计 英文PDF格式电子书版下载

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Chapter 1 Basic Concepts1

1.1 Introduction1

1.1.1 Functioning of Transistors1

1.1.2 What Are the Problems with Power Delivery?4

1.1.3 Importance of Power Delivery in Microprocessors and ICs5

1.1.4 Power Delivery Network6

1.1.5 Transients on the Power Supply8

1.2 Simple Relationships for Power Delivery10

1.2.1 Core Circuits10

1.2.2 I/O Circuits14

1.2.3 Delay Due to SSN15

1.2.4 Timing and Voltage Margin Due to SSN16

1.2.5 Relationship between Capacitor and Current17

1.3 Design of PDNs17

1.3.1 Target Impedance20

1.3.2 Impedance and Noise Voltage22

1.4 Components of a PDN24

1.4.1 Voltage Regulator24

1.4.2 Bypass or Decoupling Capacitors28

1.4.3 Package and Board Planes37

1.4.4 On-Chip Power Distribution42

1.4.5 PDN with Components45

1.5 Analysis of PDNs45

1.5.1 Single-Node Analysis48

1.5.2 Distributed Analysis55

1.6 Chip-Package Antiresonance:An Example61

1.7 High-Frequency Measurements65

1.7.1 Measurement of Impedance66

1.7.2 Measurement of Self-Impedance68

1.7.3 Measurement of Transfer Impedance70

1.7.4 Measurement of Impedance by Completely Eliminating Probe Inductance70

1.8 Signal Lines Referenced to Planes71

1.8.1 Signal Lines as Transmission Lines72

1.8.2 Relationship between Transmission-Line Parameters and SSN74

1.8.3 Relationship between SSN and Return Path Discontinuities75

1.9 PDN Modeling Methodology77

1.10 Summary79

Chapter 2 Modeling of Planes83

2.1 Introduction83

2.2 Behavior of Planes84

2.2.1 Frequency Domain84

2.2.2 Time Domain86

2.2.3 Two-Dimensional Planes88

2.3 Lumped Modeling Using Partial Inductances89

2.3.1 Extracting the Inductance and Resistance Matrices90

2.4 Distributed Circuit-Based Approaches94

2.4.1 Modeling Using Transmission Lines94

2.4.2 Transmission Matrix Method(TMM)97

2.4.3 Frequency-Dependent Behavior of Unit-Cell Elements104

2.4.4 Modeling of Gaps in Planes113

2.5 Discretization-Based Plane Models117

2.5.1 Finite-Difference Method117

2.5.2 Finite-Difference Time-Domain Method128

2.5.3 Finite-Element Method132

2.6 Analytical Methods133

2.6.1 Cavity Resonator Method133

2.6.2 Network Representation of the Cavity Resonator Model135

2.7 Multiple Plane Pairs138

2.7.1 Coupling through the Vias141

2.7.2 Coupling through the Conductors154

2.7.3 Coupling through the Apertures158

2.8 Summary169

Chapter 3 Simultaneous Switching Noise175

3.1 Introduction175

3.1.1 Methods for Modeling SSN175

3.2 Simple Models177

3.2.1 Modeling of Output Buffers180

3.3 Modeling of Transmission Lines and Planes185

3.3.1 Microstrip Configuration186

3.3.2 Stripline Configuration189

3.3.3 Conductor-Backed Coplanar Waveguide Configuration205

3.3.4 Summary of Modal Decomposition Methods207

3.4 Application of Models in Time-Domain Analysis209

3.4.1 Plane Bounce from Return Currents209

3.4.2 Microstrip-to-Microstrip Via Transition217

3.4.3 Split Planes222

3.5 Application of Models in Frequency-Domain Analysis226

3.5.1 Stripline between a Power and a Ground Plane226

3.5.2 Microstrip-to-Stripline Via Transition228

3.5.3 Reduction of Noise Coupling Using Thin Dielectrics231

3.6 Extension of M-FDM to Incorporate Transmission Lines233

3.6.1 Analysis of a Complex Board Design236

3.7 Summary239

Chapter 4 Time-Domain Simulation Methods243

4.1 Introduction243

4.2 Rational Function Method244

4.2.1 Basic Theory244

4.2.2 Interpolation Schemes246

4.2.3 Properties of Rational Functions252

4.2.4 Passivity Enforcement257

4.2.5 Integration in a Circuit Solver283

4.2.6 Disadvantages291

4.3 Signal Flow Graphs295

4.3.1 Cau'sality296

4.3.2 Transfer-Function Causality296

4.3.3 Minimum Phase296

4.3.4 Delay Extraction from Frequency Response300

4.3.5 Causal Signal Flow Graphs302

4.3.6 Computational Aspects in SFG303

4.3.7 Fast Convolution Methods307

4.3.8 Cosimulation of Signal and Power Using SFGs312

4.4 Modified Nodal Analysis(MNA)317

4.4.1 What Is MNA?317

4.4.2 Frequency Domain318

4.4.3 Time Domain320

4.4.4 MNA Formulation with S-Parameters322

4.5 Summary327

Chapter 5 Applications333

5.1 Introduction333

5.2 High-Speed Servers334

5.2.1 Core PDN Noise336

5.2.2 I/O PDN Noise345

5.2.3 Summary349

5.3 High-Speed Differential Signaling349

5.3.1 Test Vehicle Description350

5.3.2 Plane Modeling352

5.3.3 Modeling of Master and Slave Islands358

5.3.4 Rational Function Modeling361

5.3.5 Modal Decomposition and Noise Simulation361

5.3.6 Summary364

5.4 Analysis of IC Packages365

5.4.1 Simulation of a Multilayered Package Using M-FDM366

5.4.2 Causal Simulation of HyperBGA Package368

5.4.3 Summary372

5.5 Extraction of Dielectric Constant and Loss Tangent372

5.5.1 Problem Definition373

5.5.2 Corner-to-Corner Plane-Probing Method378

5.5.3 Causal Model Development386

5.5.4 Summary391

5.6 Embedded Decoupling Capacitors392

5.6.1 Embedded Individual Thin-or Thick-Film Capacitors394

5.6.2 Why Embed Individual Capacitors395

5.6.3 Design of an Embedded Thick-Film Capacitor Array395

5.6.4 Integration of Embedded Capacitors into IBM Package400

5.6.5 Embedded Planar Capacitors404

5.6.6 Summary415

5.7 Electromagnetic Bandgap(EBG)Structures415

5.7.1 Basic Theory416

5.7.2 Response of EBG Structures417

5.7.3 Dispersion-Diagram Analysis420

5.7.4 Modification of M-FDM Using Fringe and Gap Fields424

5.7.5 Scalable Design of EBG Structures for Power Plane Isolation430

5.7.6 Digital-RF Integration434

5.7.7 ADC Load-Board Design436

5.7.8 Issues with EBG Structures for Digital Systems439

5.7.9 Summary442

5.8 Future Challenges443

Appendix A451

A.1 Multiport Networks451

A.2 Matrix Representation of Transmission Lines453

A.3 Spectrum of Digital Signals454

Appendix B Software list459

Index461